Advanced Packaging Publications

Publications in Advanced Packaging

Explore the most influential research papers and scholarly works that have shaped Advanced Packaging. Use the concept filter below to focus on a specific sub-area of research.

Advanced Packaging

5.1K

Publications

199.6K

Citations

Showing yearly statistics from 2000-2026.

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	Year	Citations
Plat-E: an efficient and stable system for transient packaging of retroviruses S. Morita, T Kojima, Toshio Kitamura Gene Therapy Hardware SecurityAdvanced PackagingEngineeringAnti-virus TechniqueComputer Engineering	2000	1.6K
Recent advances on electromigration in very-large-scale-integration of interconnects K. N. Tu Journal of Applied Physics Materials ScienceAdvanced PackagingElectrical EngineeringMm Si WafersMass Transport	2003	1.1K
Food packaging — Principles and practice James P. Smith Food Research International Advanced PackagingNutritionPackage DesignFood PackagingEngineering	1993	1K
Food packaging based on polymer nanomaterials Clara Silvestre, Donatella Duraccio, Sossio Cimmino Progress in Polymer Science Materials ScienceAdvanced PackagingFood PackagingEngineeringEdible Packaging	2011	918
Developments in the active packaging of foods Lieve Vermeiren, Frank Devlieghere, M Van Beest, Trends in Food Science & Technology Advanced PackagingMeat PackagingFood PackagingFood EngineeringFood Quality	1999	839
Demystifying 3D ICs: The Pros and Cons of Going Vertical W. Rhett Davis, John Wilson, Stephen Mick, IEEE Design & Test of Computers Crosstalk TolerancesAvailable 3DEngineeringVlsi DesignComputer Architecture	2005	827
Recent innovations in barrier technologies for plastic packaging—a review Jakob Lange, Yves Wyser Packaging Technology and Science EngineeringBarrier TechnologyPolymer NanocompositesPolymersChemical Engineering	2003	817
Modified atmosphere packaging of fruits and vegetables Stewart Postharvest Review Advanced PackagingAtmosphere PackagingFood PackagingEngineeringBotany	2006	790
Ceramic and Glass‐Ceramic Packaging in the 1990s Rao Tummala Journal of the American Ceramic Society Glass‐ceramic PackagingEngineeringCeramic PowdersElectronic PackagingCeramic Technology	1991	738
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications Yi Li, C.P. Wong Materials Science and Engineering R Reports Materials EngineeringAdvanced PackagingElectrical EngineeringMaterials ScienceConductive Adhesives	2006	701
Foldable Printed Circuit Boards on Paper Substrates Adam Siegel, Scott T. Phillips, Michael D. Dickey, Advanced Functional Materials Flexible Electronic CircuitsEngineeringOrigami MetamaterialsFoldable StructureE-textiles	2009	699
Potential of biobased materials for food packaging Karina Petersen, Per Væggemose Nielsen, Grete Bertelsen, Trends in Food Science & Technology Advanced PackagingFood PackagingEdible PackagingFood EngineeringSustainable Packaging	1999	675

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